Patents

EP 2061078 and US 9083138
Micro-scale cooling element

The invention relates to a micro-scale cooling element (1) having a mounting surface (2) for a constituent part, in particular a semiconductor component, that is to be cooled, which element is configured, in particular, cuboidally and has in the interior a micro-scale cooling structure (3) that is connected via connecting conduits (4) to at least one inflow opening (5) and at least one outflow opening (6) through which a cooling medium is conveyable to and dischargeable from the micro-scale structure (3), the micro-scale cooling element having a monolithic structure.

EP 1672690 and US 9536806
Multi-component cooling element

The invention relates to a micro cooling element (1) with a mounting surface (2) for a component to be cooled, in particular a semiconductor component, which has within it a micro cooling structure (3) which is connected by connection channels (4) to at least one inflow opening (4a) and at least one outflow opening (4b) by means of which a cooling medium can be supplied to the micro cooling structure (3) or be discharged from the latter, and which is characterized in that it is formed from at least two different powdery and/or liquid, in particular metallic and/or ceramic, materials or material mixtures (10) while maintaining a monolithic structure, wherin regions of different stresses (I,II) of the micro cooling element (1) are built by a powdery and/or liquid, in particular metallic and/or ceramic materials or material mixtures (10) being adapted to an apparatus and a process for producing a micro cooling element according to the invention.

Bildnachweis Seitenkopf: Dmitriy Shironosov@123.rf